Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
1.2
1.1
Figure 8. On-Resistance Variation
vs. Temperature
2.5
2.0
1.5
1.0
1.0
0.9
*Notes:
1. V GS = 0V
0.5
*Notes:
1. V GS = 10V
T J , Junction Temperature [ C ]
T J , Junction Temperature [ C ]
0.8
-100
2. I D = 10mA
-50 0 50 100 150 200
o
0.0
-100
2. I D = 25A
-50 0 50 100 150
o
200
Figure 9. Maximum Safe Operating Area
400
100
100 μ s
Figure 10. Maximum Drain Current
vs. Case Temperature
100
80
1. T C = 25 C
10
1
Operation in This Area
is Limited by R DS(on)
*Notes:
o
1ms
10ms
100ms
DC
60
40
20
Limited by Package
2. T J = 175 C
R θ JC = 2.3 C/W
T C , Case Temperature [ C ]
0.1
0.1
o
3. Single Pulse
1 10
V DS , Drain-Source Voltage [V]
50
0
25
o
50 75 100 125 150
o
175
Figure 11. Transient Thermal Response Curve
4
0.5
1
0.2
0.1
P DM
1. Z θ JC (t) = 2.9 C/W Max.
0.1
0.05
0.02
0.01
*Notes:
t 1
t 2
o
10
10
10
10
10
10
0.01
Single pulse
-5 -4
-3
-2
-1
2. Duty Factor, D= t 1 /t 2
3. T JM - T C = P DM * Z θ JC (t)
1 10
2
Rectangular Pulse Duration [sec]
?2009 Fairchild Semiconductor Corporation
FDD050N03B Rev. C0
4
www.fairchildsemi.com
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